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www.irf.com 1 04/12/10 IRLH5034PBF hexfet power mosfet notes through are on page 8 features and benefits applications ? secondary side synchronous rectification ? inverters for dc motors ? dc-dc brick applications ? boost converters pqfn 5x6 mm note form quantit y irlh5034trpbf pqfn 5mm x 6mm ta p e and reel 4000 irlh5034tr2pbf pqfn 5mm x 6mm ta p e and reel 1000 orderable part number package type standard pac k v ds 40 v r ds(on) max (@v gs = 4.5v) 3.2 m ? q g (typical) 43 nc r g (typical) 1.2 ? i d (@t c(bottom) = 25c) 100 a features benefits low r dson ( 3.2m ? @ v g s = 4.5v ) lower conduction losses low thermal resistance to pcb ( 0.5c/w) enable better thermal dissipation 100% r g tested increased reliability low profile ( 0.9 mm) results in increased power density industry-standard pinout ? multi-vendor compatibility compatible with existin g surface mount techniques easier manufacturin g rohs compliant containin g no lead, no bromide and no halo g en environmentally friendlier msl1, industrial qualification increased reliability absolute maximum ratings parameter units v ds drain-to-source voltage v gs gate-to-source voltage i d @ t a = 25c continuous drain current, v gs @ 10v i d @ t a = 70c continuous drain current, v gs @ 10v i d @ t c(bottom) = 25c continuous drain current, v gs @ 10v i d @ t c(bottom) = 100c continuous drain current, v gs @ 10v i dm pulsed drain current p d @t a = 25c power dissipation p d @ t c(bottom) = 25c power dissipation linear derating factor w/c t j operating junction and t stg storage temperature range -55 to + 150 3.6 0.029 250 max. 29 100 400 16 40 23 100 v w a c

2 www.irf.com thermal resistance parameter typ. max. units r jc (bottom) junction-to-case ??? 0.5 r jc (top) junction-to-case ??? 15 c/w r ja junction-to-ambient ??? 35 r ja (<10s) junction-to-ambient ??? 22 static @ t j = 25c (unless otherwise specified) parameter min. typ. max. units bv dss drain-to-source breakdown voltage 40 ??? ??? v ? v dss / ? t j breakdown voltage temp. coefficient ??? 0.04 ??? v/c r ds(on) static drain-to-source on-resistance ??? 2.0 2.4 ??? 2.7 3.2 v gs(th) gate threshold voltage 1.0 ??? 2.5 v ? v gs(th) gate threshold voltage coefficient ??? -6.4 ??? mv/c i dss drain-to-source leakage current ??? ??? 20 ??? ??? 250 i gss gate-to-source forward leakage ??? ??? 100 gate-to-source reverse leakage ??? ??? -100 gfs forward transconductance 130 ??? ??? s q g total gate charge ??? 82 ??? nc q g total gate charge ??? 43 65 q gs1 pre-vth gate-to-source charge ??? 8.1 ??? q gs2 post-vth gate-to-source charge ??? 5.0 ??? q gd gate-to-drain charge ??? 24 ??? q godr gate charge overdrive ??? 5.9 ??? see fig.17 & 18 q sw switch char g e (q gs2 + q gd ) ??? 29 ??? q oss output charge ??? 31 ??? nc r g gate resistance ??? 1.2 ??? ? t d(on) turn-on delay time ??? 21 ??? t r rise time ??? 54 ??? t d(off) turn-off delay time ??? 31 ??? t f fall time ??? 21 ??? c iss input capacitance ??? 4730 ??? c oss output capacitance ??? 860 ??? c rss reverse transfer capacitance ??? 460 ??? avalanche characteristics parameter units e as sin g le pulse avalanche ener g y mj i ar avalanche current a diode characteristics parameter min. typ. max. units i s continuous source current (body diode) i sm pulsed source current (body diode) v sd diode forward voltage ??? ??? 1.3 v t rr reverse recovery time ??? 25 38 ns q rr reverse recovery charge ??? 74 110 nc t on forward turn-on time time is dominated by parasitic inductance v ds = v gs , i d = 150a a 100 ??? ??? 400 ??? ??? na ns pf nc conditions see fig.15 max. 360 50 ? = 1.0mhz v ds = 20v ??? conditions v gs = 0v, i d = 250a reference to 25c, i d = 1ma v gs = 10v, i d = 50a mosfet symbol v ds = 16v, v gs = 0v v dd = 20v, v gs = 4.5v i d = 50a v gs = 0v v ds = 25v v gs = 16v v gs = -16v v ds = 40v, v gs = 0v v gs = 10v, v ds = 20v, i d = 50a t j = 25c, i f = 50a, v dd = 20v di/dt = 400a/s t j = 25c, i s = 50a, v gs = 0v showing the integral reverse p-n junction diode. v gs = 4.5v, i d = 50a v gs = 4.5v typ. ??? r g =1.8 ? v ds = 10v, i d = 50a v ds = 40v, v gs = 0v, t j = 125c m ? a i d = 50a d s g

www.irf.com 3 fig 4. normalized on-resistance vs. temperature fig 2. typical output characteristics fig 1. typical output characteristics fig 3. typical transfer characteristics fig 6. typical gate charge vs.gate-to-source voltage fig 5. typical capacitance vs.drain-to-source voltage 0.1 1 10 100 1000 v ds , drain-to-source voltage (v) 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) vgs top 15v 10v 4.5v 4.0v 3.3v 3.1v 2.9v bottom 2.7v 60s pulse width tj = 25c 2.7v 0.1 1 10 100 1000 v ds , drain-to-source voltage (v) 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) 2.7v 60s pulse width tj = 150c vgs top 15v 10v 4.5v 4.0v 3.3v 3.1v 2.9v bottom 2.7v 1 2 3 4 5 v gs , gate-to-source voltage (v) 0.1 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) t j = 25c t j = 150c v ds = 25v 60s pulse width -60 -40 -20 0 20 40 60 80 100 120 140 160 t j , junction temperature (c) 0.5 1.0 1.5 2.0 r d s ( o n ) , d r a i n - t o - s o u r c e o n r e s i s t a n c e ( n o r m a l i z e d ) i d = 50a v gs = 10v 1 10 100 v ds , drain-to-source voltage (v) 100 1000 10000 100000 c , c a p a c i t a n c e ( p f ) v gs = 0v, f = 1 mhz c iss = c gs + c gd , c ds shorted c rss = c gd c oss = c ds + c gd c oss c rss c iss 0 20 40 60 80 100 120 q g , total gate charge (nc) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 v g s , g a t e - t o - s o u r c e v o l t a g e ( v ) v ds = 32v v ds = 20v v ds = 8.0v i d = 50a

4 www.irf.com fig 11. maximum effective transient thermal impedance, junction-to-case (bottom) fig 8. maximum safe operating area fig 9. maximum drain current vs. case (bottom) temperature fig 7. typical source-drain diode forward voltage fig 10. threshold voltage vs. temperature 0.2 0.4 0.6 0.8 1.0 1.2 1.4 v sd , source-to-drain voltage (v) 1.0 10 100 1000 i s d , r e v e r s e d r a i n c u r r e n t ( a ) t j = 25c t j = 150c v gs = 0v -75 -50 -25 0 25 50 75 100 125 150 t j , temperature ( c ) 0.5 1.0 1.5 2.0 2.5 3.0 v g s ( t h ) , g a t e t h r e s h o l d v o l t a g e ( v ) i d = 150a i d = 500a i d = 1.0ma i d = 1.0a 1e-006 1e-005 0.0001 0.001 0.01 0.1 t 1 , rectangular pulse duration (sec) 0.0001 0.001 0.01 0.1 1 t h e r m a l r e s p o n s e ( z t h j c ) c / w 0.20 0.10 d = 0.50 0.02 0.01 0.05 single pulse ( thermal response ) notes: 1. duty factor d = t1/t2 2. peak tj = p dm x zthjc + tc 0 1 10 100 v ds , drain-to-source voltage (v) 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) operation in this area limited by r ds (on) tc = 25c tj = 150c single pulse 100sec 1msec 10msec dc 25 50 75 100 125 150 t c , case temperature (c) 0 50 100 150 200 250 i d , d r a i n c u r r e n t ( a ) limited by package

www.irf.com 5 fig 13. maximum avalanche energy vs. drain current fig 12. on-resistance vs. gate voltage fig 14b. unclamped inductive waveforms fig 14a. unclamped inductive test circuit t p v (br)dss i as r g i as 0.01 ? t p d.u.t l v ds + - v dd driver a 15v 20v fig 15a. switching time test circuit fig 15b. switching time waveforms v gs v ds 90% 10% t d(on) t d(off) t r t f
1 0.1 + - 2 4 6 8 10 12 14 16 v gs, gate -to -source voltage (v) 0 2 4 6 8 10 r d s ( o n ) , d r a i n - t o - s o u r c e o n r e s i s t a n c e ( m ? ) i d = 50a t j = 25c t j = 125c 25 50 75 100 125 150 starting t j , junction temperature (c) 0 200 400 600 800 1000 1200 1400 1600 e a s , s i n g l e p u l s e a v a l a n c h e e n e r g y ( m j ) i d top 12a 18a bottom 50a

6 www.irf.com fig 16.
for n-channel hexfet power mosfets fig 17. gate charge test circuit fig 18. gate charge waveform vds vgs id vgs(th) qgs1 qgs2 qgd qgodr

? ? ? p.w. period di/dt diode recovery dv/dt ripple 5% body diode forward drop re-applied voltage reverse recovery current body diode forward current v gs =10v v dd i sd driver gate drive d.u.t. i sd waveform d.u.t. v ds waveform inductor curent d = p. w . period
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www.irf.com 7 pqfn 5x6 outline "b" package details note: for the most current drawing please refer to ir website at: http://www.irf.com/package/ pqfn 5x6 outline "b" part marking xxxx xywwx xxxxx international rectifier logo part number (?4 or 5 digits?) marking code (per marking spec) assembly site code (per scop 200-002) date code pin 1 identifier lot code (eng mode - min last 4 digits of eati#) (prod mode - 4 digits of spn code) for footprint and stencil design recommendations, please refer to application note an-1154 at http://www.irf.com/technical-info/appnotes/an-1154.pdf

8 www.irf.com qualification standards can be found at international rectifier?s web site http://www .irf.com/product-info/reliability higher qualification ratings may be available should the user have such requirements. please contact your international rectifier sales representative for further information: http://www .irf.com/whoto-call/salesrep/ applicable version of jedec standard at the time of product release.
repetitive rating; pulse width limited by max. junction temperature. starting t j = 25c, l = 0.29mh, r g = 50 ? , i as = 50a. pulse width 400s; duty cycle 2%. r is measured at t j of approximately 90c. when mounted on 1 inch square 2 oz copper pad on 1.5x1.5 in. board of fr-4 material. calculated continuous current based on maximum allowable junction temperature. package is limited to 100a by production test capability. ir world headquarters: 233 kansas st., el segundo, california 90245, usa tel: (310) 252-7105 tac fax: (310) 252-7903 visit us at www.irf.com for sales contact information . 04/2010 data and specifications subject to change without notice. ms l 1 (per je de c j-s t d-020d ??? ) rohs compliant yes pqfn 5mm x 6mm qualification information ? moisture sensitivity level qualification level industrial ?? (per je de c je s d47f ??? guidelines ) pqfn 5x6 outline "b" tape and reel

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